M&D Hardware Engineer

Job Description Summary

Join GE Vernova’s Grid Automation M&D team as a Hardware Engineer and help develop advanced hardware solutions that support the monitoring and optimization of critical grid assets such as power transformers and circuit breakers.

In this role, you will work with leading-edge technologies including SoCs, DSPs, FPGAs, and 32-bit microprocessors, applied across innovative measurement solutions such as photoacoustics. You will contribute across the full hardware lifecycle — from concept, design, and prototyping through testing and production — combining hands-on technical depth with cross-functional collaboration.

This is a great opportunity for an engineer who enjoys solving complex hardware challenges, working close to the product, and contributing to technologies that make power systems smarter, safer, and more reliable.

If you are motivated by technical ownership, innovation, and real-world impact, we would love to hear from you.

Responsibilities

Job Description

• Design and Develop hardware systems to meet the needs of all customers.
  
  
• Participate in cross-functional meetings and contribute to product development discussions.
  
  
• Conduct feasibility studies and trade off analysis to determine best hardware solutions.
  
  
• Collaborate with software/firmware engineers to ensure seamless integration of hardware and software components.
  
  
• Perform Initial bring up of PCBAs including bare metal coding for uP and SoC.
  
  
• Develop and implement test plans and procedures to verify hardware functionality and performance.
  
  
• Conduct thorough testing and debugging of hardware systems.
  
  
• Manage full lifecycle of hardware development from initial concept through prototyping, testing and production
  
  
• Provide technical support and guidance to other team members as needed.
  
  
• Ensure compliance with industry standards and regulatory requirements.
  
  
• Document all aspects of the designs, tests, results and processes.
  
  
• Work collaboratively within diverse international and cross-functional teams which may include occasional international travel.
  
  
• Apply GE Vernova way principles in day-to-day work with a safety-first mindset.
  
  
• Carry out additional duties as requested by the line manager.
  
  

Essential Criteria

• Bachelor’s degree (or equivalent experience) in relevant engineering, scientific or technical field.
  
  

Demonstrable Experience In The Following

• Analog and Digital design
  
  
• Schematic capture – Altium etc
  
  
• PCB layout – mixed technology smd, pth, QFN, QFP, BGA – fine pitch 0.65mm ball, Multilayer, single sided, double sided
  
  
• Bare metal coding for microprocessor and Systems on a Chip bring up. – embedded C / C+ etc.
  
  
• Familiarity with lab tools (oscilloscopes, soldering, DAQs, environmental test rigs, etc.) and safe lab practices.
  
  
• Ability to troubleshoot hardware setups and iterate designs quickly using first principles thinking.
  
  
• Advanced documentation and communication skills to support knowledge transfer and design traceability.
  
  
• Curiosity and initiative: willing to ask questions, try new approaches, and explore design alternatives.
  
  
• Collaborating with large, cross-functional and diverse teams, including remote environments to align on key design decisions.
  
  
• Communicating technical matters clearly and concisely, both in writing and verbally.
  
  
• Safety-conscious mindset, especially when working with lab hardware, electronics, and test environments.
  
  

Desirable Criteria

• Experience with RTOS
  
  
• Experience with scripting – Python , C for test automation
  
  
• PSU design
  
  
• FPGA layout and coding
  
  
• DSP layout and coding
  
  
• Design and layout for EMC
  
  
• Masters degree (or equivalent experience) in relevant engineering, scientific or technical field.
  
  
• Exposure to Agile for Hardware development.
  
  
• Familiarity with lean engineering practices and continuous improvement initiatives.
  
  

Additional Information

Relocation Assistance Provided: No